While the politics of the IEEE have dominated the headlines about UltraWideBand recently, actual product advances have been harder to find than soundbites from supporters of the two sides. This week, however, we have seen progress from Wisair of Israel towards real silicon for the MultiBand OFDM implementation of UWB ‘ the Intel/TI-backed contender to provide the IEEE 802.15.3a standard ‘ as well as new funding for one of the most interesting players, Staccato. Wisair demonstrated the first UWB transceiver to meet the physical layer (PHY) specification of Multiband OFDM at this week’s Intel Developer Forum in Tokyo. The chip is designed to support, in particular, high speed video and wireless USB peripheral links over UWB ‘ spanning the PC…