The announcement this week from US operator Windstream, that it would experiment in a commercial pilot with bonded G.fast technology represents another win for chip vendor Sckipio in the G.fast market, as well as device partner Calix. Windstream has only made a G.fast solution available for MDUs in the Lincoln, Nebraska region, where initially at least, the operator will deploy in two apartment complexes, reaching about 550 homes across 25 buildings, and then expand from there. Talking to Michael Weissman, head of marketing at Sckipio, he said, “This is a landmark because it is the first publicly available G.fast implementation in the world and it is the 1st bonded version available, and that makes it the first to go over…